Comment on More thermal paste = more heat dissipation, right?
Washedupcynic@lemmy.ca 19 hours ago
Oh no, oh no no no no no.
Comment on More thermal paste = more heat dissipation, right?
Washedupcynic@lemmy.ca 19 hours ago
Oh no, oh no no no no no.
Thorry@feddit.org 19 hours ago
Washedupcynic@lemmy.ca 18 hours ago
Optimal thermal paste thickness (bond-line thickness) is critical for heat dissipation. The layer should be thin, ideally between 25 µm and 50 µm, which is roughly the thickness of two sheets of standard paper. The paste’s sole purpose is to fill microscopic air pockets between the metal surfaces for better thermal conduction. Source, I spent 6 months in a laboratory experimenting with and producing thermal pastes and insulators. I spent days cutting and cleaning copper squares, applying the experimental pastes, and testing thermal conductivity via the application of Fourier’s Law of heat conduction.
Q = kA(Δ T/Δ X)
Where Q is heat flow, A is the cross-sectional area, and Δ x is the paste’s thickness.
Another source.
That’s way more paste than you need for 50 µm application.
Drops Mic
ZkhqrD5o@lemmy.world 17 hours ago
Did you say 50mm of thermal paste?
Washedupcynic@lemmy.ca 17 hours ago
Microns, not milimeters. One micron in 1/1000 of a milimeter.
foodandart@lemmy.zip 17 hours ago
I think he said 50m…
DeadDigger@lemmy.zip 14 hours ago
To add to this to much is also a problem because it can trap air itself and create air pockets that way
TrickDacy@lemmy.world 18 hours ago
I can’t tell if this is satire. If not, you say it doesn’t hurt to use too much, but I would say that a company would want to save all the money wasted on applying 20x the required amount…
Thorry@feddit.org 18 hours ago
Washedupcynic@lemmy.ca 17 hours ago
Love how you ignored my response to your response that provided a scientific rationale demonstrating that you don’t have a clear understanding of how thermal paste works, and you just doubled down on flawed opinions. Carry on friend.
TrickDacy@lemmy.world 17 hours ago
The perfect amount would be a very thin layer, evenly distributed with zero waste. This is very much not that. At best you could argue it’s a quick way to do it that is worth the trade-off, except for the valid point the other commenter made about too much actually reducing heat conduction.