this has got to be a troll post. right? RIGHT?!
as you pointed out, just get rid of the air gaps with the absolute minimal amount of paste.
my back woods method
ensure your heat sink does not have pre-applied paste or a pad. apply a small amount of paste. cut the thickness with the short edge of an old credit card at about a 30° angle, using just enough pressure to bend the card slightly so the smooth surface of the card presses paste into voids and the trailing edge of the card removes excess to level the surface - you will likely still be able to make out some chip package markings through the paste. remove all edge excess and spillage. fit your heat sink. done.
Thorry@feddit.org 18 hours ago
TropicalDingdong@lemmy.world 17 hours ago
@Washedupcynic@lemmy.ca
Image
Washedupcynic@lemmy.ca 17 hours ago
The best part was being accused of being a troll. There is no sense in playing chess with pigeons, they just knock all the pieces around, shit on the board, then claim they won the game.
Abyssian@lemmy.world 17 hours ago
Clearly you’re a troll. I bet you don’t even know it’s ok to use a roofing nail gun to attach a circuit board to… other things. And people. And they should all be dipped in varnish after the thermal paste.
TrickDacy@lemmy.world 17 hours ago
Writes a novel
qprimed@lemmy.ml 17 hours ago
did your article measure aging? assuming you didn’t fry your PC with the excess paste, there is no edge seal on voids when you use too much. over time most paste will dry and crack, creating new voids and hot spots. there is a difference between hour old transfer compound and 2 year old compound.