Who is saying that is the major consideration here?
Its obvious the major problem here is ustable movement and flexing when those large sink plates are screwed down.
Comment on More thermal paste = more heat dissipation, right?
wewbull@feddit.uk 14 hours agoThermal compound has a thermal resistance. It’s better than air, but not as good as metal. The best application is a layer that fills all the air gaps, and no more.
Fedizen@lemmy.world 13 hours ago
Bytemeister@lemmy.world 14 hours ago
Adding to this… Airgaps is not emphasized enough here. There is a reason why do don’t do closed shapes when applying thermal computer, and why so many system builders have strong opinions on how to apply it.
Personally, I go for an X or a % where the os are actually dots.
DarkSirrush@piefed.ca 11 hours ago
I still do the just under pea sized amount right in the middle, have always gotten a good spread with it.