Comment on More thermal paste = more heat dissipation, right?

Fedizen@lemmy.world ⁨16⁩ ⁨hours⁩ ago

• wewbull@feddit.uk ⁨16⁩ ⁨hours⁩ ago

  Thermal compound has a thermal resistance. It’s better than air, but not as good as metal. The best application is a layer that fills all the air gaps, and no more.

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  • Bytemeister@lemmy.world ⁨15⁩ ⁨hours⁩ ago

    Adding to this… Airgaps is not emphasized enough here. There is a reason why do don’t do closed shapes when applying thermal computer, and why so many system builders have strong opinions on how to apply it.

    Personally, I go for an X or a % where the os are actually dots.

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    • DarkSirrush@piefed.ca ⁨12⁩ ⁨hours⁩ ago

      I still do the just under pea sized amount right in the middle, have always gotten a good spread with it.

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  • Fedizen@lemmy.world ⁨15⁩ ⁨hours⁩ ago

    Who is saying that is the major consideration here?

    Its obvious the major problem here is ustable movement and flexing when those large sink plates are screwed down.

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