Comment on More thermal paste = more heat dissipation, right?
TrickDacy@lemmy.world 4 weeks agoI can’t tell if this is satire. If not, you say it doesn’t hurt to use too much, but I would say that a company would want to save all the money wasted on applying 20x the required amount…
Thorry@feddit.org 4 weeks ago
Washedupcynic@lemmy.ca 4 weeks ago
Love how you ignored my response to your response that provided a scientific rationale demonstrating that you don’t have a clear understanding of how thermal paste works, and you just doubled down on flawed opinions. Carry on friend.
Thorry@feddit.org 4 weeks ago
TropicalDingdong@lemmy.world 4 weeks ago
@Washedupcynic@lemmy.ca
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TrickDacy@lemmy.world 4 weeks ago
Writes a novel
qprimed@lemmy.ml 4 weeks ago
did your article measure aging? assuming you didn’t fry your PC with the excess paste, there is no edge seal on voids when you use too much. over time most paste will dry and crack, creating new voids and hot spots. there is a difference between hour old transfer compound and 2 year old compound.
qprimed@lemmy.ml 4 weeks ago
this has got to be a troll post. right? RIGHT?!
as you pointed out, just get rid of the air gaps with the absolute minimal amount of paste.
my back woods method
ensure your heat sink does not have pre-applied paste or a pad. apply a small amount of paste. cut the thickness with the short edge of an old credit card at about a 30° angle, using just enough pressure to bend the card slightly so the smooth surface of the card presses paste into voids and the trailing edge of the card removes excess to level the surface - you will likely still be able to make out some chip package markings through the paste. remove all edge excess and spillage. fit your heat sink. done.
TrickDacy@lemmy.world 4 weeks ago
The perfect amount would be a very thin layer, evenly distributed with zero waste. This is very much not that. At best you could argue it’s a quick way to do it that is worth the trade-off, except for the valid point the other commenter made about too much actually reducing heat conduction.