I don’t think we’re really getting anywhere with this, but that’s kinda my point.

Take a large pan and set it off-center on the smallest burner on your stove top. The entire pan will get warm, yes, but the part directly over the flame is going to get the hottest.

The cpu is the flame, the pan is the phone. If you have to wrap the pan in some sort of protective coat, but want to effectively dissipate heat with the smallest hole possible, the smartest design would be to place the opening over the source of the heat, not the center of heat sink.

If the cpu is in the top corner of the phone, the top corner of the phone is going to get significantly warmer than the rest of the phone (in terms of thermal dissipation). Putting a vent hole in the center where there’s less heat while having the warm part covered makes no sense.